Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062614 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | John Bruley, Jack O. Chu, Kam-Leung Lee, Paul M. Solomon, Jeng-Bang Yau | 2024-08-13 |
| 11862567 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | John Bruley, Jack O. Chu, Kam-Leung Lee, Paul M. Solomon, Jeng-Bang Yau | 2024-01-02 |