Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869875 | Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof | Joon Young Park, Ji Hye Yoon | 2024-01-09 |
| 11869879 | Semiconductor package using a coreless signal distribution structure | Do Hyung Kim, Seung Chul Han | 2024-01-09 |