Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12178022 | Manifold microchannel heat sink based on directional optimization of hotspot area | Zhiqiang Wang, Yu Liao, Xiaojie Shi, Yong-Mook Kang | 2024-12-24 |
| 12112110 | Multi-physics co-simulation method of power semiconductor modules | Zhiqiang Wang, Yayong Yang, Yuxin Ge, Xiaojie Shi | 2024-10-08 |
| 11976984 | Method and system for predicting junction temperature of power semiconductor module in full life cycle, and terminal | Zhiqiang Wang, Yayong Yang, Xiaojie Shi, Yong-Mook Kang | 2024-05-07 |