Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12095387 | Multi-level direct current converter and power supply system | Guolei Yu, Shuchao Song, Junliang Qin | 2024-09-17 |
| 12089336 | Electronic component package body, electronic component assembly structure, and electronic device | — | 2024-09-10 |
| 11955891 | Packaged module and metal plate | — | 2024-04-09 |
| 11887918 | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method | Xuanwei Fang | 2024-01-30 |