Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984407 | Package structure and communications device with suppressed ion migration in bonding material | Zhihua Zhao, Kaizhan Wang | 2024-05-14 |
MC
Mengyi Cao
Overall (2024): #347,770 of 561,600Top 65%
1
Patents 2024