Issued Patents 2024
Showing 26–26 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11859685 | Formation method for liquid rubber composite nodes with damping through holes | Haitao Cheng, Wensong Liu, Sheng Lin, Wansheng Feng, Junhui Chen +2 more | 2024-01-02 |