Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057429 | Temporary bonding structures for die-to-die and wafer-to-wafer bonding | Aurelio Lopez, Partia Naghibi Mahmoudabadi, Erik S. Daniel, Tahir Hussain | 2024-08-06 |
| 12040311 | Substrate debonding from bonded part | Chia-Ming Chang, Sevag Terterian, Charbel Abijaoude, Diego Eduardo Carrasco | 2024-07-16 |