Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869908 | Photosensitive chip package structure, camera module, and mobile terminal | Atsushi Yajima, Kun RAN, Lifeng Fu, Weichih Lin, Changfu Huang | 2024-01-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869908 | Photosensitive chip package structure, camera module, and mobile terminal | Atsushi Yajima, Kun RAN, Lifeng Fu, Weichih Lin, Changfu Huang | 2024-01-09 |