Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176664 | Power connector module | Wei-Kai Hsiao | 2024-12-24 |
| 12154939 | High capacitance MIM device with self aligned spacer | Ching-Sheng Chu, Dun-Nian Yaung, Yu-Cheng Tsai, Ching-Chung Su, Jen-Cheng Liu +2 more | 2024-11-26 |