Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071703 | Electroplating solution for indium-bismuth alloy for low-temperature solder with improved bismuth substitution prevention performance | Jong Uk Kim | 2024-08-27 |
| 11879181 | Electroplating solution of tin or tin alloy with improved thickness variation of wafer bumps | Jong Uk Kim, Jin-gyu Lee | 2024-01-23 |