YI

Yoshifumi Ichikawa

SC Sodick Co.: 1 patents #4 of 32Top 15%
Overall (2024): #207,601 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11872759 Lamination molding apparatus Atsushi Kawamura, Kensuke Kashimura, Toshio Kaji, Yasuyuki MIYASHITA 2024-01-16