Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11938688 | Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate | Noriaki Murakami, Ryoichi UCHIMURA, Kenichi Ohhashi | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11938688 | Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate | Noriaki Murakami, Ryoichi UCHIMURA, Kenichi Ohhashi | 2024-03-26 |