HM

Hikari Murai

RE Resonac: 1 patents #77 of 285Top 30%
📍 Ibaraki, JP: #184 of 527 inventorsTop 35%
Overall (2024): #444,213 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11930594 Adhesive film for multilayer printed-wiring board Aya Kasahara, Yasuyuki Mizuno 2024-03-12