Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990422 | Ferrite electro-magnetic interference (EMI) shield between an integrated-circuit (IC) chip and an air-core inductor all inside a hybrid lead-frame package | Chik Wai (David) Ng, Kwun Yuan (Godwin) Ho, Tin Ho (Andy) Wu, Wai Kit (Victor) So | 2024-05-21 |