Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11951739 | Fluidic die with high aspect ratio power bond pads | Eric Martin, James R. Przybyla, Rogelio Cicili | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11951739 | Fluidic die with high aspect ratio power bond pads | Eric Martin, James R. Przybyla, Rogelio Cicili | 2024-04-09 |