Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11988561 | Method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing | Jörg Schieferdecker, Frank Herrmann, Christian Schmidt, Bodo Forg, Marion Simon +1 more | 2024-05-21 |