Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12075587 | Heat transfer interfaces for circuit card assembly (CCA) modules | Alexander Trotman, Josh Kamp, Judy Schwartz, Robert DeFelice, Anthony DeLugan | 2024-08-27 |
| 12044488 | Interlocking dovetail geometry joint | Callie Lynn Benson, Daniel E. Muntges, John Sypek, Keith J. Brooky, Paul M. Colson | 2024-07-23 |