Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12082334 | Devices and methods to improve thermal conduction from SMT and chip on board components to chassis heat sinking | John A. Dickey | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12082334 | Devices and methods to improve thermal conduction from SMT and chip on board components to chassis heat sinking | John A. Dickey | 2024-09-03 |