Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978668 | Integrated circuit devices including a via and methods of forming the same | Harsono S. Simka, Anthony Dongick LEE, Seowoo Nam, Sang-Hoon Ahn | 2024-05-07 |
| RE49820 | Semiconductor device having a self-forming barrier layer at via bottom | Larry Zhao, Xunyuan Zhang, Sean Xuan Lin | 2024-01-30 |