Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136649 | Deep trench isolation structures with a substrate connection | Jianbo Zhou, Shiang Yang Ong, Hung-Chang Liao, Zhongxiu Yang | 2024-11-05 |
| 11908930 | Laterally-diffused metal-oxide-semiconductor devices with a multiple-thickness buffer dielectric layer | Shiang Yang Ong | 2024-02-20 |