YC

Yu-Ju Chang

GU Global Unichip: 1 patents #9 of 31Top 30%
TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #203,846 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11862551 Interposer and semiconductor package each having conductive terminals on redistribution layer with different pitch Jia-Liang Chen, Chun-Hong Chen 2024-01-02