Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027361 | High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics | Dawson Yee, Craig S. Ranta, Cliff C. Lee, Douglas P. Kelley, David B. Tuckerman | 2024-07-02 |