Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166115 | Solder resist structure for embedded die packaging of power semiconductor devices | Ahmad Mizan, Maryam Abouie | 2024-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166115 | Solder resist structure for embedded die packaging of power semiconductor devices | Ahmad Mizan, Maryam Abouie | 2024-12-10 |