Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12037460 | Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure | — | 2024-07-16 |
| 11882122 | Preparation device, preparation system, preparation method, and preparation program | Koki Nomura, Yukio NAGAFUCHI, Iifan TYOU, Tetsuhiko MURATA, Koji Morishita +4 more | 2024-01-23 |