Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11998397 | Thermal conductive layer for transducer face temperature reduction | Keith A. Williams | 2024-06-04 |
| 11890140 | Ultrasound transducer assembly | Gregg W. Frey, Simon Hsu | 2024-02-06 |