Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048102 | Electronic circuit production method using 3D layer shaping | Ryojiro Tominaga, Kenji Tsukada, Ryo SAKAKIBARA | 2024-07-23 |
| 11945886 | Cured resin formation method and cured resin formation device | Ryojiro Tominaga | 2024-04-02 |