MI

Morio Iwamizu

FC Fuji Electric Co.: 3 patents #17 of 220Top 8%
Overall (2024): #73,162 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12068268 Semiconductor device having a wire bonding pad structure connected through vias to lower wiring 2024-08-20
12033941 Trimming circuit and trimming method 2024-07-09
12021528 Semiconductor device 2024-06-25