Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12096577 | Power semiconductor arrangement having a cover facility and method for releasing it | Sandro Bulovic, Thomas Götze, Alexander Wehner, Markus Müller, Peter Lemke +4 more | 2024-09-17 |
| 11866817 | Thin-film deposition methods with thermal management of evaporation sources | Ulrich Bonne | 2024-01-09 |