RS

Ryo Saegusa

FC Fasford Technology Co.: 1 patents #1 of 5Top 20%
📍 Minami-Alps, JP: #3 of 7 inventorsTop 45%
Overall (2024): #286,858 of 561,600Top 55%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12068275 Die bonding apparatus and manufacturing method for semiconductor device Masayuki Mochizuki, Keita Yamamoto 2024-08-20