Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942409 | High density low power interconnect using 3D die stacking | Prasad Subramaniam | 2024-03-26 |
FM
Ferran Martorell
Overall (2024): #468,801 of 561,600Top 85%
1
Patents 2024