MH

Marc Huesgen

RG Rf360 Europe Gmbh: 1 patents #1 of 6Top 20%
QU Qualcomm: 1 patents #1,016 of 2,255Top 50%
📍 Singapore, SG: #536 of 1,870 inventorsTop 30%
Overall (2024): #359,473 of 561,600Top 65%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12142577 Package comprising metal layer configured for electromagnetic interference shield and heat dissipation Philipp Michael Jaeger 2024-11-12