TG

Ting Gao

TC Te Connectivity Co.: 2 patents #37 of 213Top 20%
TG Te Connectivity Germany Gmbh: 1 patents #39 of 147Top 30%
TG Te Connectivity Services Gmbh: 1 patents #1 of 7Top 15%
Overall (2024): #63,391 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12077706 Hybrid silicone composite for high temperature applications Dejie Tao, Yiliang Wu, Lananh Pham, Lei Wang, Andre Martin Dressel +1 more 2024-09-03
11859092 Printable non-curable thixotropic hot melt composition Lei Wang, Martin W. Bayes, Philip Singer, James Zeigler 2024-01-02
11859093 Printable non-curable thixotropic hot melt composition Lei Wang, Martin W. Bayes, Kenneth C. Seufer, Jr., Philip Singer, James Zeigler 2024-01-02