Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002773 | Hybrid pocket post and tailored via dielectric for 3D-integrated electrical device | Chad W. Fulk, Aaron M. Ramirez | 2024-06-04 |
| 11894477 | Electrical device with stress buffer layer and stress compensation layer | Emily Thomson, Michael J. Rondon | 2024-02-06 |