HO

Hideyo Osanai

DC Dowa Metaltech Co.: 2 patents #2 of 20Top 10%
Overall (2024): #161,361 of 561,600Top 30%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12145352 Metal/ceramic bonding substrate and method for producing same 2024-11-19
11919288 Method for producing heat radiation member Akira Sugawara 2024-03-05