Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942336 | Underfill film for semiconductor package and method for manufacturing semiconductor package using the same | Taejin CHOI, Sooin Park, Jungjin Lee | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942336 | Underfill film for semiconductor package and method for manufacturing semiconductor package using the same | Taejin CHOI, Sooin Park, Jungjin Lee | 2024-03-26 |