Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12097633 | Cutting method | Takashi Okamura | 2024-09-24 |
| 11935738 | Method of processing a wafer | Takashi Okamura | 2024-03-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12097633 | Cutting method | Takashi Okamura | 2024-09-24 |
| 11935738 | Method of processing a wafer | Takashi Okamura | 2024-03-19 |