Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094776 | Wafer processing method | Susumu Yokoo, Hiroyuki Takahashi, Yoshio Watanabe, Kenji Okazaki, Yoshiteru Nishida | 2024-09-17 |
| 11992916 | Fine adjustment thread assembly and processing apparatus | Toshiyasu Rikiishi | 2024-05-28 |