Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134138 | Wafer manufacturing method | — | 2024-11-05 |
| 12119230 | Wet etching method and wet etching system | Takashi Ono, Daigo Shitabo | 2024-10-15 |
| 12087589 | Method of manufacturing wafer and method of manufacturing stacked device chip | — | 2024-09-10 |
| 12080564 | Package substrate processing method | — | 2024-09-03 |
| 12040214 | Processing apparatus including a cassette mounting section, a reading section, and an information transmitting section transmitting information on progress of process steps to customer that has ordered the processing of each workpiece | — | 2024-07-16 |
| 12017314 | Fixed temperature liquid supply apparatus | Miki Yoshida, Kei MINE | 2024-06-25 |
| 12011784 | Wafer, wafer manufacturing method, device chip manufacturing method, and resistivity markings | — | 2024-06-18 |
| 11858090 | Grinding apparatus and method of driving grinding apparatus | — | 2024-01-02 |