Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100679 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2024-09-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100679 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2024-09-24 |