Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990393 | Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate | — | 2024-05-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990393 | Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate | — | 2024-05-21 |