Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11912489 | Package accommodating heat dissipation substrate and packing box | Hiroaki Ota, Daisuke Goto | 2024-02-27 |
| 11903168 | Heat dissipation member | Daisuke Goto | 2024-02-13 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11912489 | Package accommodating heat dissipation substrate and packing box | Hiroaki Ota, Daisuke Goto | 2024-02-27 |
| 11903168 | Heat dissipation member | Daisuke Goto | 2024-02-13 |