Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114419 | Micro-ground vias for improved signal integrity for high-speed serial links | William Andrew Smith, Bhyrav M. Mutnury | 2024-10-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114419 | Micro-ground vias for improved signal integrity for high-speed serial links | William Andrew Smith, Bhyrav M. Mutnury | 2024-10-08 |