Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11995241 | System and method of a modular seamless haptic touchpad assembly and method of manufacture of the modular seamless haptic touchpad | Priyank Gajiwala, Trevor R. Todd, Wu Chin-Chung, Robert D. Hrehor, Jr. | 2024-05-28 |