Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12017470 | Resin composition for back-surface layer and heat-sensitive transfer recording material | Mikiyoshi NAMURA, Takeshi Kawaguchi | 2024-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12017470 | Resin composition for back-surface layer and heat-sensitive transfer recording material | Mikiyoshi NAMURA, Takeshi Kawaguchi | 2024-06-25 |