Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11866570 | Molding powder | Hirokazu Komori, Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa +4 more | 2024-01-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11866570 | Molding powder | Hirokazu Komori, Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa +4 more | 2024-01-09 |