Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12116434 | Wafer cup | Eri Mukai | 2024-10-15 |
| 12054566 | Molded article and production method therefor | Eri Mukai, Yuuki KUWAJIMA, Masahiro Kondo | 2024-08-06 |
| 12036714 | Molding material and tube | Hiroyuki Hamada, Eri Mukai, Masahiro Kondo | 2024-07-16 |
| 11926753 | Fluororesin material, fluororesin material for high frequency transmission, and covered electric wire for high-frequency transmission | Masahiro Kondo | 2024-03-12 |