Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12152169 | Adhesive conductive paste | Takanori KOBATAKE, Tomoya Egawa | 2024-11-26 |
| 12073957 | Conductor material | Toshihiro Okamoto, Tadanori Kurosawa, Yu Yamashita, Junichi Takeya, Daiji IKEDA +1 more | 2024-08-27 |
| 12049540 | Dopant and conductor material | Toshihiro Okamoto, Tadanori Kurosawa, Junichi Takeya, Daiji IKEDA, Takeshi Yokoo | 2024-07-30 |
| 12046390 | Dopant, electroconductive composition and method for producing same | Toshihiro Okamoto, Tadanori Kurosawa, Junichi Takeya, Daiji IKEDA | 2024-07-23 |