Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967446 | Packaging structure of a magnetic device | Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang | 2024-04-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967446 | Packaging structure of a magnetic device | Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang | 2024-04-23 |