Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11953462 | Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects | Robert Alan Bellman, Scott Christopher Pollard | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11953462 | Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects | Robert Alan Bellman, Scott Christopher Pollard | 2024-04-09 |