Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151962 | Apparatus and method for controlling substrate thickness | Anping Liu, Michael Yoshiya Nishimoto, William Anthony Whedon, Jae Hyun Yu | 2024-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151962 | Apparatus and method for controlling substrate thickness | Anping Liu, Michael Yoshiya Nishimoto, William Anthony Whedon, Jae Hyun Yu | 2024-11-26 |